ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,663, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Singulation of integrated circuit package substrates with gla... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,664, issued on Sept. 22, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Wire bonding arrays, maintenance stati... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,665, issued on Sept. 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Substrate and method of manufacturin... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,666, issued on Sept. 22, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Package structures, fabricating methods the... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,667, issued on Sept. 22, was assigned to TDK Corp. (Tokyo). "Electronic circuit package, its manufacturing method, and electronic device h... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,668, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Dam surrounding a die on a substrate" was invented by Liang H... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,669, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Protective coating on an edge of a glass core" was invented b... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,670, issued on Sept. 22, was assigned to ELTA SYSTEMS LTD. (Lod, Israel). "Encapsulation techniques" was invented by Itzhak Shapir (Haifa,... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,671, issued on Sept. 22, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device having first and second organi... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,672, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure with inte... Read More